Nexcom Train Computer – aROK 5510
Intel® Core™ 8th/9th Generation/Xeon® CPU Powerful Platform for AI Application and Storage Server with Rich Storage
Main Feature
- Intel® Coffee Lake S/Refresh 8./9. Generation Core™/Xeon® LGA1151 socket type CPU
- Support 100W power consumption graphics card
- Support eight SIM cards + four WWAN modules
- LTE/5G WWAN module support
- 6 x External SSD for RAID 0, 1, 5, 10
- PCIe 3.0 x4 NVMe 1.3 high-performance SSD support
- EN 50155, class OT4 conformity
- 3 x mini-PCIe + 3 x M.2 socket expansion
- Intelligent fan design with temperature-based RPMs
- Optional expansion module for 4 x PoE M12 or 2 x 10GbE SFP+
- Rack mounting platform
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Datasheet
The aROK 5510, a powerful and reliable Artificial Intelligence (AI) platform, is specifically designed for rail vehicle applications such as track obstacle inspection, traffic light and traffic sign recognition, pantograph inspection, and high-demand graphics performance. It is equipped with an Intel® Coffee Lake S/Refresh 8th/9th Generation Core™/Xeon® desktop CPU, and the optional discrete graphics card ensures graphics performance that meets most AI requirements. Support for dual SIM cards per modem allows eight SIM cards to be backed up by software for better connection quality. In addition, the eight SIM cards and four WWAN module architecture can increase bandwidth for faster data transfer speed. RAID 0, 1, 5, 10 ensures the security of video data on six external SSDs. The aROK 5510 maintains the flexibility to meet the demand of different rail vehicle applications such as infotainment, dispatch system, transportation cellular router, video server, and video surveillance.
| Processor | 8th/9th Supports generation Intel® Core™ i7 / i5 / i3 / Xeon® E-2278GEL, TDP 35W - Intel® Celeron® G4900T, TDP 35W |
| Chipset | Intel® C246 platform controller hub |
| Memory | 4 x 260-pin 2400MHz DDR4 SO-DMIM socket Up to 32GB/channel (128GB for quad channel) Supported ECC memory: i3-9100TE/i3-8100T, E-2278GEL, G4900T |
| Video Output | Chipset Intel® UHD graphics 630 1 x HDMI 1.4b up to 4096 x 2160 @ 30Hz 1 x VGA up to 1920 x 1200 @ 60Hz |
| Discrete Graphics Card (optional) | NVIDIA® GEFORCE® GTX 1650 SUPER up to 100W, 1280 CUDA® cores, 4GB GDDR6 |
| Storage | 6 x 2.5” SATA external SSD (compatible with 9.5mm drive) 1 x mSATA 1 x M.2 2280/2242/2260 Key M socket SATA 3.0 or PCIe 3.0 x4 1 x Removable SD 3.0 for NVMe 1.3 |
| Expansion | 1 x Full-size mini-PCIe socket (USB 2.0, PCIe 3.0) 1 x Full-size mini-PCIe socket (USB 2.0, PCIe 3.0), BOM optional for LTE module with 2 external SIMs full-size mini-PCIe socket (USB 2.0) 1 x Full-size mini-PCIe socket (USB 2.0), BOM optional M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen1/PCIe 3.0 (BOM optional), PCIe 3.0 (BOM optional)) 3 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen 2) for LTE/5G NR module with 2 external SIMs For LTE/5G NR module with 2 x external SIM |
| GNSS and Onboard Sensor | 1 x Default U-blox NEO-M8N GNSS module G Sensor (3-axis, 10-bit resolution) for GPS/Glonass/QZSS/Galileo/Beidou |
| Power over LAN and Ethernet | 2-Port LAN M12 X-coded, 10/100/1000 Mbps Intel® I210/I219 (iAMT support) GbE 2-Port LAN 10GbE SFP+ (optional) 4-Port LAN M12 X-coded, 10/100/1000 Mbps, PoE 802.3af/at, max. 60W (optional) |
| Security | TPM 2.0: Infineon SLB9665TT2.0FW5.62 |
| I/O Interface-Front | 12 x LED indicators (including 2 x programmable LEDs) 1 x HDMI 1.4b 1 x VGA 1 x M12 A-coded connector for 2 x USB2.0 3 x USB 3.1 Gen 2 type A (5V/1A) 1 x USB 3.1 Gen 1 type A (5V/1A) 8 x Externally accessible SIM card socket with cover 6 x 2.5" removable SSD tray (locked) 1 x SD cover 1 x Reset button 1 x Power button 20 x SMA antennas 2 x LAN M12 X-coded, Intel® I210/I219 (iAMT support) 10/100/1000 Mbps 1 x DB9 (AUDIO) 1 x Microphone in, 2 x Line out for Full RS232 (isolation) 2 x DB9 (COM1/COM2) for Full RS232/422/485 (isolation) 2 x DB9 (COM3/COM4) 1 x DB15 (CAN/DIO) - 1 x Isolated CANBus 2.0B - 4 x DI and 4 x DO (isolation) - Power input for DIO isolation, 9~48VDC 1 x Waterproof DC input connector with ignition - 24VDC input with 2.5KVDC isolation - 110VDC input with 2.5KVDC isolation |
| I/O Interface-Rear | 4 x Smart fans (replaceable) for system cooling |
| Power Management | Power input 24VDC/110VDC isolated Software selectable startup and shutdown voltage for low power protection Software 8-stage power on/off delay time adjustment Support S3/S4 suspend mode 0~255 seconds WDT support, software setup SDK (Windows/Linux) including utility and sample code |
| Operating System | Windows 10/Linux |
| Dimensions | 483 x 400 x 95 (W x D x H) (mm) *Please reserve a total height of 3U for ROK 5510 in the rack |
| Weight | 8.5 kilos |
| Environment | Operating temperatures: EN 50155, class OT4 (-40~70°C), 85°C for 10 minutes (with 35W TDP CPU, 100W TDP GPU, industrial SSD) with airflow Storage temperatures: -40°C~80°C Relative humidity: 90% (non-condensing) Vibration (random) - 2g@5~500 Hz (operating, SSD) Vibration (SSD) - Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure - Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity test Shock (SSD) - Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g - Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test = 75g |
| Certificates | BU FCC Class A EN 50155: 2017 - Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes - Voltage supply interruptions class S1 - Supply change classes C1, C2 - EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019 - Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30 - Shock and vibration IEC 61373 Class B - Protective coating class PC1 (PC2, on request) EN 45545-2: 2013+A1:2015 (PCB) |
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