Nexcom Train Computer – aROK 8110

Intel® 8th/9th Generation Core™/Xeon® CPU + Powered Inference Accelerator for Autonomous and Machine Vision AI

Main Feature

  • Railway vehicle AI recognition and machine vision applications
  • Up to 8 cores Intel® 8th/9th Generation Core™/Xeon® CPU processing power
  • 4 x PCIe 3.0 slots for discrete graphics/inference/frame grabber cards
  • Ultra-fast NVMe M.2/U.2 media for high-speed multi-camera image capture
  • RAID 0/1/5/10 configurable for data security and integrity
  • 24/36 VDC input with ignition management
  • Special fixture design prevents vibration issues on GPU and PCIe cards
  • WWAN/5G NR, WLAN and GNSS functionality with up to 4 SIM slots
  • Complies with EN 50155 OT4 and MIL-STD-810G against vibration/shock with graphics card and PCIe card installed
  • Intelligent fan design with temperature-based RPMs

Request Datasheet

Artificial intelligence has become a core component of automated vehicle technology. With built-in high-performance Intel®  Coffee  -Lake S/Refresh or Xeon®  processing power and  a powerful NVIDIA® GeForce® RTX 2080 Ti graphics engine with 4,352 CUDA® cores  the  aROK  8110 can meet a wide range of railway vehicle applications, such as track obstacle inspection, traffic light and traffic sign recognition, pantograph inspection, and others that place high demands on graphics performance.

 

With the rapid growth of high-speed multi-cameras with high frame rates, extreme data storage speed has become increasingly important. Therefore, the aROK 8110 is designed with up to 3 USB 3.1 and up to 12 GbE w/ PoE GigE M12 X-code ports to achieve wire-speed performance of high-quality industrial cameras. It also implements the latest ultra-fast U.2/M.2 NVMe media and up to four 2.5-inch high-density SSD/HDDs to meet customer demands for large data throughput, security, and integrity for deployed multi-cameras.

 

The aROK 8110 also provides excellent expansion capabilities for users to install up to four add-on PCIe cards, such as the frame grabber on the GigE Vision interface, or a separate graphics engine to increase graphics power. To localize your location and maintain connection with remote central management when the system is in edge computing, the aROK 8110 is your best choice to provide telematics functionality, such as up to two LTE/WLAN modems, GNSS with DR function, and eMTC cooperating with other communication ports, RS232/422/485 and CAN 2.0B module, etc.

 

aROK 8110 is a more flexible design for users to choose the CPU they want to run. It can also support station-class Xeon® with up to 80W TDP to work with up to 250W RTX 2080 Ti discrete graphics card   .

Processor Intel® Coffee-Lake S/Refresh Core™/Xeon® i7/i5/i3/Pentium®/Celeron® processor (LGA1151)
PCH Intel® chipset C246
Memory Two 260-pin DDR4 SO-DMIM sockets, up to 32GB+32GB size, 2400/2666MHz Supported ECC memory: i3-8100/8100T, i3-9100T/9100TE, E-2124G, E-2278GE/2278GEL, G5400/5400T, G4900/4900
Storage 4 x 2.5” SATA 3.0 SSD/HDD (15mm height) or 3 x 2.5” SATA 3.0 SSD/HDD + 2 x M.2 2242/2260/2280 Key M NVMe SSD (PCIe 3.0 x2) or 3 x 2.5” SATA 3.0 SSD/HDD + 1 x U.2 NVMe SSD (PCIe 3.0 x2) 1 x CFast (externally accessible)
Expansion 1 x Full-size mPCIe socket (USB 2.0, PCIe 3.0) 1 x Full-size mPCIe socket (USB 2.0) for LTE module, BOM optional M.2 3042 Key B socket (USB 2.0), 1 x external, 1 x internal with SIM for LTE module 1 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen2) 1 x external, 1 x internal with SIM for LTE/5G NR module 1 x PCIe 3.0 x16 slot for discrete graphics card, length up to 321mm 3 x PCIe 3.0 x4 slot, length up to 240mm
GigE/Frame Grabber (optional) 4-Port standalone GbE w/ 802.3af/at, max 60W, M12 X-coded
Discrete Graphics Card (optional) Up to NVIDIA® RTX 3090, 450W or higher
GPS and Sensor 1 x Default U-blox NEO-M8N GNSS module Built-in G-sensor for GPS/Glonass/QZSS/Galileo/Beidou
AND 2-Port independent GbE LAN, M12 X-coded 9K byte jumbo frame PTP (IEEE 1588) support Controller: Intel® i210-T1, PHY: Intel® I219LM vPro (iAMT) and WOL support
Security TPM 2.0: Infineon SLB9660TT1.2-FW4.40
I/O Ports, Faceplate Waterproof DC input connector with ignition for 24/36 VDC-IN Power button Reset button 6 x LED indicators for power/IGN/WLAN/WWAN/LAN status 4 x LED indicators for storage/fan control 5 x LED indicators for user programming 1 x USB 3.1 Gen2 + 1 x USB 2.0, type A 1x DB15 (CAN/DIO, 4x DI/4x DO + 1x CAN 2.0B) 1 x DB15 (EXT.), reserved for expansion 7 x SMA antenna holes 2 x DB9 (COM3/COM4) selectable for RS232/RS422/RS485 (isolation)
I/O Ports, Backplate 2 x USB 3.1 Gen2, type A 1 x M12 A-coded connector for 2 x USB 2.0 2 x GbE (M12 X-coded) 1 x VGA + 1 x HDMI 2 x DB9 (COM1/COM2) selectable (isolation) for RS232/RS422/RS485 2 x SIM slot 1 x SMA antenna hole for GNSS 6 x SMA antenna hole 1 x PCIe x16 ribbon slot 3 x PCIe x4 ribbon slot 1 x DB9 (AUDIO, female) for 1 x Microphone in (stereo), 2 x Line out (stereo)
View 1 x VGA port, up to 1920 x 1200@60Hz 1 x HDMI v1.4, up to 4096 x 2160@30Hz
DI/DO (isolation) 4-Bit input
- Source: 9~48V-IN (12V@1.1mA/24V@2.2mA)
- External: 0~33VDC pull-high, high level, 3.3-33VDC; low level, 0-2VDC 
4-Bit output
- Source: 9~48V-IN (nominal 35mA@24V)
- External: 5~27VDC pull-high, sink current with 220mA for each bit, 500mA max (@25C) 
Selectable by source or external software (default: source type)
Fan 1 x CPU fan 1 x System fan
CAN 2.0B (isolation) CAN 2.0B (isolation) Controller: SJA1000 Bit rate up to 1Mbit/s Socket CAN supported 11-bit and 29-bit identifiers, ISO 11898-1, ISO 11898-2 ESD: ±8KV/15KV (contact/air) 2.5KV isolated
Power Management 24/36 VDC-INPUT Cranking voltage: 6V~9V (< 30 seconds) Reverse protection, OCP and UVP Ignition on/off control/programmable on/off delay timer
Operating System Windows 10/Linux
Dimensions 215 x 385 x 205 (W x D x H) (mm)
Weight 10.5 kilos
Environment Operating temperatures
- EN 50155, class OT4 -40~70°C, 85°C for 10 minutes (with 35W TDP CPU, industrial SSD) with air flow 
Storage temperatures: -40°C~85°C Relative humidity: 10%~95% (non-condensing) Vibration (random)
- IEC 60068-2-64 1.0g@5~500Hz (operating, HDD), 1.6g for HDD with damping bracket
- IEC 60068-2-64 2.0g@5~500Hz (operating, SSD + graphics card) 
Vibration (SSD + graphics card)
- Operation: MIL-STD-810G, 514.6C, category 4
- Storage: MIL-STD-810G, 514.6, category 24, minimum integrity test 
Shock (SSD + graphics card)
- Operating: MIL-STD-810G, Method 516.6, procedure I, functional shock=40g
- Non-operating: MIL-STD-810G, Method 516.6, procedure V, impact hazard shock test=75g
Certificates BU FCC Class A EN 50155: 2017
- Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes
- Voltage supply interruptions class S1
- Supply change classes C1, C2
- EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019
- Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30
- Shock and vibration IEC 61373 Class B
- Protective coating class PC1 (PC2, on request) 
EN 45545-2: 2013+A1:2015
Manual (Please   Contact Sales Department )
History Definition Version YOU Download
2022-03-10 User Manual (Datasheet Only) Windows 0.73MB
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