Nexcom Vehicle Computer-CORE – VTC 7270

12/13th Generation Intel® Core™ CPU Fan-Powered Artificial Intelligence-Enabled Vehicle Computer

Main Feature

  • Supported by 12/13th Generation Intel® Core™ i with DDR5, excellent memory bandwidth, lower latency
  • Rich I/O, 2 x 2.5GbE, 1 x GbE, 6 x USB 3.2, 2 x CAN FD and 4 x Serial, 2 x 2.5” SSD, 1 x NVMe ultra-fast SSD for data integrity
  • Optionally up to 2 Hailo AI accelerators (26TOPS workload each) computing power
  • Up to 4 WWAN/WLAN combinations for mobile router applications
  • 9~36V DC-IN with ignition control and OCP/OVP
  • -35°C~70°C wide operating temperature range (fanless@35W CPU)
  • Military standard against vibration/shock
  • CE/FCC, UKCA, Emark Certified

Request Datasheet

The VTC 7270 is an AI-powered in-vehicle telematics computer equipped with a 12/13th Generation Intel®  Core  ™ processor, offering 30% more computing power than its predecessor. It is a suitable option for a variety of in-vehicle applications to reduce maintenance costs, including fleet management, logistics/AMR, ITS, construction, ANPR and security surveillance.

To operate as Edge AI, users can install LTE/5G modems, Wi-Fi 5/6 modules, and Hailo AI accelerators (26TOPS) to deploy collaborative AI services with cloud SaaS. It is an advanced AI-powered telematics computer that is reliable even in harsh environments.

Processor 12/13th Generation Intel® Core™ i, Intel® R680E chipset Graphics:
- Intel® UHD Graphics 770, 1.55GHz
- Maximum resolution: 4096 x 2160@60 Hz (HDMI)
- DirectX: 12, OpenGL: 4.5
Memory (optional) 2x SO-DIMM, DDR5-4800MHz ECC and dual channel support
Storage 2 x 2.5” SSD (15mm height, removable) 1 x M.2 2280 Key M (PCIe4.0 x4), NVMe SSD by default, Hailo AI card (optional)
Expansion Slots 1 x mPCIe slot (PCIe 3.0, SATA 3.0, USB 2.0), Wi-Fi (default), optional 1 x mPCIe slot (USB 3.2, PCIe 3.0, SATA 3.0), SIM support, LTE modem (default), optional for Wi-Fi/mSATA by DIP S/W setting 1 x M.2 3042/50/52 Key B socket (USB 3.2/2.0), SIM support for LTE/5G modem 1 x M.2 2230 Key E socket (PCIe 3.0 x 2 and USB 2.0), Wi-Fi (default), optional Hailo AI card
View 1 x HDMI 2.0a/b up to 3840 x 2160@60Hz 1 x VGA up to 1920 x 1200@60Hz; 1 x DP, 4096x2304@60Hz
2.5GbE 2-port independent 2.5GbE, RJ45 connector
- 9KB Jumbo frame
- PTP (IEEE 1588) support
- Controller: Intel® I226-IT
GbE/MGT 1-port independent GbE, RJ45 connector
- vPro (iAMT)
- 9KB Jumbo frame
- PTP (IEEE 1588) support
- Wake-up function (WoL)
- Boot from PXE (Legacy and UEFI)
USB 6 x USB 3.2 Gen 2:
- Host Type-A connector
- 5V@900mA each
- Link speed up to 10Gbit/s and USB 2.0 (LS/FS/HS link speed) compatibility
Serial Port 2 x Full RS232/422/485 2 x Full RS232 RS232 working voltage, +- 9V, baud rate up to 115.2kbps 2-wire/4-wire RS-485 (Baud rate: 300~115.2Kbps)
Security TPM 2.0: Infineon SLB9670VQ2.0 FW7.62
Audio and DC-OUT Line out, unbalanced stereo, left and right channel Line in and MIC in, stereo DC-OUT: 12VDC@2A
MEMS Sensor 3D accelerometer and 3D gyroscope, ST LSM6DSLTR
OF/THO 4 bit input
- Source: 9~36VDC (12V@1.1mA/24V@2.2mA)
- External: 0~33VDC pull-high, high level, 3.3 to 33 VDC; low level, 0 to 2 VDC 
4 bit output
- Source: 9~36VDC (nominal 35mA@24V)
- External: 5~27VDC pull-high, sink current with 220mA for each bit, 500mA max (@25C) 
Selectable by source or external DIP S/W (default: source type)
CAN Bus 2 x CAN FD, compatible with CAN2.0A/2.0B Up to 5Mb/s in data transmission IEC 61000-4-2 Electrostatic Discharge (ESD): ±4KV/8KV (contact/air)
GNSS u-blox NEO-M9N GNSS module for GPS/Gloness/QZSS/Galileo/Beidou Optional DR (Full Calculation) function, NEO-M9V/M8L
Power supply Rated voltage: 9~36V Cranking voltage: 6V~9V (less than 20 seconds) OCP and UVP (shuts down when exceeding 37V) Ignition on/off control and programmable on/off delay timer Optional for remote power on/off control
I/O Ports, Faceplate ATX power and reset button 9 x LED Indicators 4 x Nano SIM slot (SIM1-1, SIM1-2, SIM2-1, SIM2-2) 2 x USB3. 2 Type A 1 x HDMI, 1 x DP Fan power connector 4 x 2.5GbE (RJ45), 1 x GbE (RJ45) 2 x Removable 2.5” SSD bay 1 x Multi-port DB15 (4 x DI, 4 x DO, 2 x CAN FD) 1 x PR-SMA for GNSS, 2/4 x SMA for LTE/5G.
I/O Ports, Backplate 2 x RS232 (DB9), 2 x RS232/422/485 (DB9) 4 x USB 3.2 type A Line in, Line out, Audio jack for MIC in 1 x VGA 1 x Mini-fit connector (DR signal and DC-OUT) 5-pin for 9~36VDC input 2/4 x PR-SMA for Phoenix Wi-Fi.
Dimensions and Weight 260.0 mm x 210.0 mm x 81.0 mm (without mounting bracket) 293.0 mm x 210 mm x 90.0 mm (with mounting bracket) 5.7 kg, 6.8 kg (with fan kit)
Environment Operating temperatures: -35°C~70°C (35W CPU, without fan) Operating temperatures: -35°C~70°C (65W CPU, with fan) Storage temperatures: -40°C~85°C Relative humidity: 10%~95% (non-condensing)
Vibration and Shock Vibration in operation:
- MIL-STD-810H, 514.8C Procedure 6, Category 4
- IEC 60068-2-64: 2.0g@5~500 Hz 
Vibration in storage:
- MIL-STD-810H, 514.8E Procedure 1, Category 24, 7.7g 
Shock:
- MIL-STD-810H, 516.8 Procedure I, trucks and semi-trailers = 40g
- Collision hazard: Procedure V, ground equipment = 75g
Certificates CE approval, FCC Class A, UKCA, E13 Certified
Operating System Windows 10 64-bit/ Windows 10 IOT 64-bit, Windows 11 Linux (Ubuntu 18.04)
Options CPU:
- Intel® Core™ i9-12900E/12900TE, Core: 16c, Maximum Frequency: 5.0/4.8GHz, TDP: 65W/35W
- Intel® Core™ i7-12700E/12700TE, Core: 12c, Maximum Frequency: 4.8/4.6GHz, TDP: 65W/35W
- Intel® Core™ i5-12500E/12500TE, Core: 6c, Maximum Frequency: 4.5/4.3GHz, TDP: 65W/35W
- Intel® Core™ i3-12100E/12100TE, Core: 4c, Maximum Frequency: 4.2/4.0GHz, TDP: 60W/35W 
SO-DIMM DDR5-4800MHz:
- CPU: 64GB (future), Core: 32GB, Frequency: 16GB, TDP: 8GB 
FAN Kit
- Model No.: VTK FAN120-01, Description: 120mmx120mm, 60W heat dissipation, P/N: 10VK00FAN00X0
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