Nexcom Vehicle Computer-ATOM – VTC 7260-x

Intel® Core™ 11th Generation CPU Fan-Powered Artificial Intelligence-Enabled Vehicle Computer

Main Feature

  • Intel® 11th Generation Tiger Lake UP3, cost-effective performance
  • Compact, robust and fanless design
  • Rich I/O, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 and 3 x RS232/422/485
  • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
  • Up to 3 LTE/5G, Wi-Fi 5/6 combinations for mobile router function
  • Triple display for multiple video output, VGA, HDMI and DP
  • 9~36V DC-IN with ignition control and OCP/OVP
  • -30°C~70°C (12W TDP) wide operating temperature range
  • Military standard for anti-vibration/shock protection for OHV applications
  • CE/FCC, UKCA, Emark Certified

Request Datasheet

VTC 7260-x is an in-vehicle AI-powered telematics computer designed with Intel 11th Generation Tiger Lake UP3, providing 25% more processing power than the previous generation. What's more, the 10-year product lifecycle policy can meet suitable long-term support for any in-vehicle applications. With its compact, rugged and fanless design, the VTC 7260-x can be easily installed in any limited cabin space, reducing maintenance effort while providing 24/7 service. Furthermore, the VTC 7260-x features various peripherals, such as 2.5GbE, USB 3.2, isolated CANBus, serial ports, ultra-fast NVMe storage, triple displays, audio in/out, DI/DO and IGN control and 9~36VDC, making it an advanced in-vehicle computer.

To work as edge AI, user can install LTE/5G/Wi-Fi 5/6 modules together with Hailo AI accelerator (26TOPS) to deploy AI services delivered from cloud SaaS. Considering harsh environment applications, VTC 7260-x can operate within the temperature range of -30°C~70°C (12W TDP) and comply with MIL-STD-810G military standard for vibration/shock. For regulation, VTC 7260-x complies with CE/FCC Class A, UKCA and EMARK (E13).

Processor Intel® Core™ 11th Generation Tiger Lake UP3 Core i5-1145GRE, base frequency 1.5GHz/ 2.6GHz, 4c, 8MB Intel® Smart Cache (VTC 7260-5) TDP boot mode in BIOS setting: nominal (15W) Core i7-1185GRE, base frequency 1.8GHz/ 2.8GHz, 4c, 12MB Intel® Smart Cache (VTC 7260-7) Graphics:
- Intel® Iris® Xe graphics, 1.3GHz
- Maximum resolution: 4096 x 2304@60 Hz (HDMI)
- DirectX: 12.1, OpenGL: 4.6
Memory 2x SO-DIMM, DDR4-3200MHz Default 4GB+4GB, maximum 64GB. ECC (in-band ECC), dual channel support
Storage 1 x 2.5” SSD (15mm height) 1 x mPCIe for mSATA (SATA 3.0) 1 x M.2 2242/2280 Key M NVMe SSD (PCIe 4.0x4), optional Hailo AI card
Expansion slots 1 x mini-PCIe socket (PCIe 3.0/USB 3.2 + USB 2.0), 2 x micro SIM supported 1 x M.2 3042/3052 Key B socket (USB 3.2), 2 x micro SIM supported 1 x M.2 2230 Key E socket (PCIe 3.0 x2 and USB 2.0), optional Wi-Fi or Hailo AI card
View 1 x HDMI 2.0a/b, up to 3840 x 2160@60Hz 1 x VGA, up to 2560 x 1600@60Hz 1 x DP, up to 4096 x 2304@60Hz
2.5GbE 2-port independent 2.5GbE, RJ45 connector
- 9K byte jumbo frame
- PTP (IEEE 1588) support
- Controller: Intel® I225-IT
To carry 1-port independent GbE, RJ45 connector
- Support vPro (iAMT)
- Wake-up function (WoL)
USB 3 x USB3.2 Gen1:
- Host type A connector 
1 x USB 2.0, host type A
Serial Port 2 x full RS232/422/485, selectable 1 x full RS232, 1 x full RS232 wafer type reserved
Security TPM 2.0: Infineon SLB9670VQ2.0 FW7.62
Sound Line output, unbalanced stereo, left and right channel MIC input, stereo Line input reserved (wafer connector)
MEMS Sensor 3D accelerometer and 3D gyroscope Controller: ST LSM6DSLTR
OF/THO 4 bit input 4 bit output
CAN bus 1 CAN 2.0A/ 2.0B 2.5KV isolated
GNSS U-blox NEO-M9N GNSS module for GPS/GLONESS/QZSS/Galileo/Beidou Optional DR (Dead Reckoning) function, NEO-M8U/M8L
Power supply Rated voltage: 9~36V Cranking voltage: 6V~9V (less than 20 seconds) OCP and UVP (shuts down when exceeding 37V) Ignition on/off control and programmable on/off delay timer Optional for remote power on/off control
I/O ports, Faceplate ATX power button, Reset button , 9 x LED Indicators, 1 x VGA (DB15), 2 x COM (DB9, RS232/422/485), 1 x Multi-port (DB15, 4xDI, 4xDO, CAN, DR signal), 1 x External (DB15, reserved), 1 x PR-SMA for GNSS, 4 x PR-SMA for WLAN
I/O ports, Back plate 2 x Audio jack (Output and MIC input) , 3 x USB 3.2 type A, 1 x USB 2.0 type A , 1 x HDMI, 1 x DP, 4 x PoE+ (2.5GbE, RJ45), 1 x COM (DB9, RS232), 1 x GbE, 9~36 VDC (3-pin Phoenix), 4 x SMA for WWAN, 4 x antenna hole reserved
I/O ports, side plate 2 x SIM slots (SIM1-1, SIM2-1)
Dimensions and Weight 210.0 mm x 173.0 mm x 75.0 mm (without mounting brackets) 234.0 mm x 173.0 mm x 81.0 mm (with mounting brackets) Weight: 3.5 kg
Environment Operating temperatures: -30°C~65/70°C (15W/12W TDP) Storage temperatures: -40°C~85°C Relative humidity: 10%~95% (non-condensing)
Vibration and Shock Vibration in operation:
- MIL-STD-810H, 514.8C Procedure 6, Category 4
- IEC 60068-2-64: 2.0g@5~500Hz 
Vibration in storage:
- MIL-STD-810G, 514.6E Procedure 1, Category 24, 7.7g 
Shock:
- MIL-STD-810G, 516.6 Procedure I, trucks and semi-trailers = 40g
- Collision hazard: Procedure V, ground equipment = 75g
Certificates CE approval, FCC Class A, UKCA, E13 Certified
Operating System Windows 10 64-bit/Windows 10 IOT 64-bit, Windows 11 Linux (Ubuntu 18.04)
External Cable (optional) DB15 multiport adapter cable, 20cm
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