Nexcom Train Computer – nROK 7270
Fanless Rolling Stock Computer with 12/13th Generation Intel® Core™ CPU
- Main Feature
- Powered by 12/13th Generation Intel® Core™ CPU
- Fanless, compact and robust design
- Designed with DDR5, excellent memory bandwidth, lower latency
- 2 x 2.5” SSD for data integrity (compatible with 15mm disk)
- Support 5G/Wi-Fi, PoE, 10GbE, daughter card expansion
- Two video outputs, one VGA and one HDMI
- 4 x Independent 10/100/1000/2500 Mbps PoE 802.3 af/at, total 60W (nROK 7270-AC4)
- Military standard against vibration/shock
- EN 50155, class OT3 conformity
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Datasheet
NEXCOM system nROK 7270 realizes the operational efficiency of public transportation and service. Based on Intel® 12 /13th generation FCLGA1700 socket type CPU and 4/12-port 802.3 af/at PoE, it provides an integrated solution with high computing power. Supporting dual SIM cards per modem, it allows backup of two SIM cards by software for better connection quality. RAID 0, 1, guarantees the security of data in 2 x external SSD. With daughter card expansion design, it provides additional 1 x mini-PCIe slot (BOM for M.2 Key E is optional) and 2 x M.2 Key B slots for optional, an 8-port 1Gbps Ethernet Switch GbE, PoE 802.3af/at, max. The nROK 7270 with 60W or 2-port 10GbE M12 X-code maintains flexibility to meet the demand for different rolling stock applications such as infotainment, transportation cellular router, video server, and video surveillance.
| Processor | Intel® 12/13th Generation Core™ CPU (65W/35W), Chipset: Intel R680E, Graphics: Intel® UHD Graphics770,1.55GHz |
| Memory | 2 x 262-pin SO-DIMM, DDR5 4800MHz Max 64GB, ECC and dual channel support |
| Video Output | 1 x HDMI 2.0a/b, up to 3840 x 2160@60Hz 1 x VGA, up to 1920 x 1200@60Hz |
| Storage | 2 x 2.5” SATA 3.0 external SSD (15mm height, removable) 1 x mSATA (occupied mini-PCIe slot) 2 x M.2 Key B (occupied M.2 socket) 1 x microSD card slot, SDXC v3.01 |
| Expansion | 1 x Full-size mini-PCIe socket (USB2.0, PCIe 3.0/SATA 3.0) 2 x M.2 3042/3050/3052 Key B socket (USB2.0, USB 3.2 Gen 2, SATA 3.0) 1 x M.2 2230 Key E socket (USB2.0, PCIe 3.0 x2) for LTE/5G NR module with external dual nano-SIM, BOM optional M.2 2230 Key E socket (USB2.0, PCIe 3.0, PCIe 3.0) |
| GNSS and Onboard Sensor | 1 x Default U-blox NEO-M9N GNSS module for GPS+QZSS/Glonass/Galileo/Beidou 1 x 3D accelerometer and 3D gyroscope |
| Power over LAN and Ethernet | nROK 7270-AC4: - 1-port LAN M12 802.3af/at, max. 60 W (non-isolated) nROK 7270-A: - 2-port LAN M12 X-coded, 10/100/1000/2500 Mbps Intel® I226 GbE (WOL support) |
| Security | TPM 2.0: InfineonSLB9665TT2.0FW5.62 |
| I/O Interface-Front | 4 x LED indicators (storage/WWAN/WLAN/programmable) 1 x HDMI 2.0a/b 2 x USB 3.2 Gen 2 type A (5V/0.9A) 2 x Externally accessible dual nano-SIM card slots with covers 1 x microSD card slot with covers 2 x 2.5” removable SSD tray 1 x Reset button 1 x Power button nROK 7270-AC4: - 1 x M12 X-coded LAN port - 4 x M12 X-coded PoE 802.3af/at nROK 7270-A: - 2 x M12 X-coded LAN ports 1 x Fan power connector 1 x SMA connector for GNSS 4 x SMA connector hole for WWAN |
| I/O Interface-Rear | 1 x VGA 2 x M12 A-coded 8-pin for USB 2.0 1 x M8 (Audio) 1 x Microphone input, 1 x Line output 2 x DB9 (COM1/2) for full RS232/422/485 (isolation) 1 x DB15 (CAN/DIO) - 2 x Isolated CAN FD, compatible with CAN2.0A/2.0B - 4 x DI and 4 x DO (isolation), power at source for DIO isolation, 14~48VDC 1 x M12 K-coded 5-pin for power input 1 x 2-pin connector for firing input 4 x SMA connector hole for WWAN 4 x RP-SMA connector hole for WLAN 2 x External accessible dual nano-SIM card socket hole with cover, 8 x SMA connector hole for WWAN and 2 x for WLAN RP-SMA connector hole (reserved for 5G/Wi-Fi expansion card) |
| Power Management and Software Support | Power input 24VDC/36VDC (14~48VDC) non-isolated Software selectable startup and shutdown voltage for low power protection Software 8-stage power on/off delay time adjustment Support S3/S4 suspend mode 10~255 seconds WDT support, software setup SDK (Windows/Linux) including utility and sample code |
| Operating System | Windows 11/Windows 10/Linux |
| Dimensions | 260 x 210 x 80 (W x D x H) (mm) |
| Weight | nROK 7270-AC4: 5.41 kg nROK 7270-A: 5.36 kg |
| Environment | Operating temperatures - EN 50155, class OT3 (-35°C ~70°C), 85°C for 10 minutes (with 35W TDP CPU, 60/120W PoE, 8GB memory, industrial SSD) with airflow Storage temperatures: -40°C to 80°C Relative humidity: 90% (non-condensing) - Vibration (random) - 2g@5~500 Hz (operating, SSD) Vibration (SSD) - Operating: MIL-STD-810H, Method 514.8C, Procedure 1, Category 4, common carrier U.S. highway truck vibration exposure - Storage: MIL-STD-810H, Method 514.8E, Procedure 1, Category 24, minimum integrity test Shock (SSD) - Operating: MIL-STD-810H, Method 516.8, Procedure I, functional shock=40g - Inoperative: MIL-STD-810H, Method 516.8, Procedure V, crash hazard shock test=75g |
| Certificates | CE/UKCA/FCC Class A EN 50155: 2021 - Ambient temperature EN 50155, Class OT3 (-35°C ~70°C), 85°C for 10 minutes - Voltage supply interruptions class S1 - Supply change class C1 - EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019 - Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30 - Shock and vibration IEC 61373 Class B - Protective coating class PC1 (PC2 on request) EN 45545-2: 2020+A1: 2023 |
| Options | Intel® Core™ CPU: - i9-12900E/12900TE, Core: 16c, Max Frequency: 5.0/4.8GHz, TDP: 65W/35W - i7-12700E/12700TE, Core: 12c, Max Frequency: 4.8/4.6GHz, TDP: 65W/35W - i5-12500E/12500TE, Core: 6c, Max Frequency: 4.5/4.3GHz, TDP: 65W/35W - i3-12100E/12100TE, Core: 4c, Max Frequency: 4.2/4.0GHz, TDP: 60W/35W SO-DIMM DDR5-4800MHz: - 64GB (future), 32GB, 16GB, 8GB FAN Kit - Model No.: VTK FAN120-02, Description: 120mmx120mm, P/N: 10VK00FAN02X0 * Note: 65W CPU must be included with the fan kit |
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