Nexcom Train Computer – nROK 7252-WI2-C8S
Fanless Rolling Stock Computer with Intel® 8th/9th Generation Core™/Xeon® CPU
Main Feature
- Intel® Coffee Lake S/Refresh 8./9. Generation Core™/Xeon® LGA1151 socket type CPU
- Support six SIM cards + three WWAN modules
- LTE/5G WWAN module support
- 2 x External SSD (compatible with 15mm disk) for RAID 0, 1, 5, 10
- 2 x mSATA (mini-PCIe slot occupied)
- EN 50155, class OT4 conformity
- Three video outputs, one VGA and two HDMI
- 3 x mini-PCIe + 2 x M.2 socket expansion
- 1 x SD card for exporting and backing up data
- Wide voltage input 24~110VDC (isolated)
- Protection against transient voltage drops for up to 3 seconds
Request
Datasheet
The NEXCOM system nROK 7252 realizes the operational efficiency of public transportation and service. Based on Intel® Coffee Lake S/Refresh 8th/9th Generation Core™/Xeon® LGA1151 socket type CPU and 8-port 802.3 af/at PoE, it provides an integrated solution with high computing power. Supporting dual SIM cards per modem, it enables six SIM cards to redundant each other through software for better connection quality. In addition, the six SIM cards and three WWAN module architecture can increase the bandwidth for faster data transmission speed. RAID 0, 1, 5, 10, 2 x external SSD ensures the security of data. nROK 7252 maintains the flexibility to meet the demand for different railway vehicle applications such as infotainment, transportation cellular router, video server and video surveillance.
| Processor | 9./8. generation Intel® Core™ i7 / i5 / i3, supports Xeon® E-2278GEL, TDP 35W - Intel® Celeron® G4900T, TDP 35W |
| Chipset | Intel® C246 platform controller hub |
| Memory | 2 x 260-pin DDR4 SO-DMIM socket Up to 32 GB/channel (64 GB for dual channels) Supported ECC memory: i3-9100TE/i3-8100T, E-2278GEL, G4900T |
| Video Output | Chipset Intel® UHD graphics 630 2 x HDMI 1.4b up to 4096 x 2160 @ 30Hz 1 x VGA up to 1920 x 1200 @ 60Hz |
| Storage | 2 x 2.5” SATA 3.0 external SSD (15mm) 2 x mSATA (occupied mini-PCIe slot) 1 x Removable SD 3.0 |
| Expansion | 1 x Full-size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA) 1 x Full-size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA), BOM optional M.2 3042 Key B socket (USB 2.0, USB 3.1 Gen 1) for LTE/5G NR module with 2 x external SIM 1 x Full-size mini-PCIe socket (USB 2.0, USB 3.1 Gen 2 (BOM optional)) for LTE module, BOM optional M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen 2, PCIe 3.0 (BOM optional)) 2 x M.2 3042/3050/3052 Key B socket for LTE/5G NR module with 2 x external SIM (USB 2.0, USB 3.1 Gen 2, PCIe 3.0 (BOM optional)) for LTE/5G NR module with 2 x external SIM |
| GNSS and Onboard Sensor | 1 x Default U-blox NEO-M8N GNSS module G Sensor (3-axis, 10-bit resolution) for GPS/Glonass/QZSS/Galileo/Beidou |
| Power over LAN and Ethernet | 2 - Port LAN M12 60W |
| Security | TPM 2.0: Infineon SLB9665TT2.0FW5.62 |
| I/O Interface-Front | 24 x LED indicators (including 3 x programmable LEDs) 2 x HDMI 1.4b 1 x VGA 1 x USB 3.1 Gen 2 type A (5V/1A) 1 x USB 3.1 Gen 1 type A (5V/1A) 6 x Externally accessible SIM card socket with cover 2 x 2.5” removable SSD tray 1 x SD cover 1 x Reset button 1 x Power button 10 x SMA antenna |
| I/O Interface-Rear | 2 x LAN M12 X-coded, I210/I219 10/100/1000 Mbps 8 x PoE 802.3af/at (max. 60W), M12 X-coded 1 x Microphone input, 2 x Line output (AUDIO, DB9, female) 1 x M12 A-coded connector for 2 x USB 2.0 2 x USB 3.1 (5V/1A) type A 2 x DB9 (COM1/COM2) for full RS232 (isolation) 1 x DB9 (COM3) for full RS232/422/485 (isolation) 1 x DB15 (CAN/DIO) - 1 x Isolated CANBus 2.0B - 4 x DI and 4 x DO (isolation) - Power input for DIO isolation, 9~48VDC 1 x Water-ignited waterproof DC input connector - 24~110VDC (isolated) 3 x SMA antenna |
| Power Management and Software Support | Power input 24~110VDC isolated 2.2~3 sec (170W~120W) protection against transient voltage drops Software selectable startup and shutdown voltage for low power protection 8-stage power on/off delay time adjustment by software Support S3/S4 suspend mode 10~255 seconds WDT support, software setup SDK (Windows/Linux) including utility and sample code |
| Operating System | Windows 10/Linux |
| Dimensions | 260 x 266 x 110 (W x D x H) (mm) |
| Weight | 7.6 kilos |
| Environment | Operating temperatures: EN 50155, class OT4 -40~70°C with airflow of 85°C (with industrial SSD) for 10 minutes Storage temperatures: -40°C to 80°C Relative humidity: 90% (non-condensing) Vibration (random) - 2g@5~500 Hz (operating, SSD) Vibration (SSD) - Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure - Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity test Shock (SSD) - Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g - Non-operating: MIL-STD-810G, Method 516.6, Procedure V, collision hazard shock test=75g |
| Certificates | BU FCC Class A EN 50155: 2017 - Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes - Voltage supply interruptions class S1, S2 - Supply change classes C1, C2 - EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019 - Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30 - Shock and vibration IEC 61373 Class B - Protective coating class PC1 (PC2, on request) EN 45545-2:2013+A1:2015 (PCB) |
| Manual (Please Contact Sales Department ) | ||||
|---|---|---|---|---|
| History | Definition | Version | YOU | Download |
| 2022-03-10 | User Manual (Datasheet Only) | Windows | 0.86 MB | |
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