Nexcom Train Computer – nROK 7271
Fanless Rolling Stock Computer with 12/13th Generation Intel® Core™ CPU
Main Feature
- Powered by 12/13th Generation Intel® Core™ CPU
- Fanless, compact and robust design
- Designed with DDR5, excellent memory bandwidth, lower latency
- 2 x 2.5” SSD for data integrity (compatible with 15mm disk)
- Support 5G/Wi-Fi, PoE, 10GbE, daughter card expansion
- 4 x Independent 10/100/1000/2500Mbps PoE 802.3af/at, total 60W (nROK 7271-WIC4 without PoE extension card) / 30W (nROK 7271-WIC4 with PoE extension card)
- EN 50155, class OT3 conformity
- Wide voltage input 24~110VDC (isolated)
- Optional protection against transient voltage drops for up to 3 seconds
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Datasheet
The NEXCOM system nROK 7271 realizes the operational efficiency of public transportation and service. Based on Intel® 12 /13th Generation FCLGA1700 socket type CPU and 4/12-port 802.3 af/at PoE, it provides an integrated solution with high computing power. Supporting dual SIM cards per modem, it enables software backup of two SIM cards for better connection quality. RAID 0, 1, 2 x external SSDs ensures the security of data. The nROK 7271 further differentiates itself by providing power isolation for 24~110VDC and optional up to 3 seconds protection against transient voltage drops, a critical feature for scenarios where input voltage variations may cause equipment shutdown. Daughter card expansion design, additional 1 x mini-PCIe slot (BOM for M.2 Key E optional) and 2 x M.2 Key B slots, 8-port 1Gbps Ethernet Switch GbE, PoE 802.3af/at, max. 30W or 2-port 10GbE M12 X-code nROK 7271 maintains the flexibility to meet the demand of different rolling stock applications, such as infotainment, transportation cellular router, video server and video surveillance.
| Processor | Intel® 12/13. Generation Core™ CPU (65W/35W), Chipset: Intel R680E, Graphics: Intel® UHDGraphics770,1.55GHz |
| Memory | 2 x 262-pin SO-DIMM, DDR5 4800MHz Max 64GB, ECC and dual channel support |
| Video Output | 1 x HDMI 2.0a/b, up to 3840 x 2160@60Hz 1 x VGA, up to 1920 x 1200@60Hz |
| Storage | 2 x 2.5” SATA 3.0 external SSD (15mm height, removable) 1 x mSATA (occupied mini-PCIe slot) 2 x M.2 Key B (occupied M.2 socket) 1 x microSD card slot, SDXC v3.01 |
| Expansion | 1 x Full-size mini-PCIe socket (USB2.0, PCIe 3.0/SATA 3.0) 2 x M.2 3042/3050/3052 Key B socket (USB2.0, USB 3.2 Gen 2, SATA 3.0) 1 x M.2 2230 Key E socket (USB2.0, PCIe 3.0 x2) for LTE/5G NR module with external dual nano-SIM, BOM optional M.2 2230 Key E socket (USB2.0, PCIe 3.0, PCIe 3.0) |
| GNSS and Onboard Sensor | 1 x Default U-blox NEO-M9N GNSS module for GPS+QZSS/Glonass/Galileo/Beidou 1 x 3D accelerometer and 3D gyroscope |
| Power over LAN and Ethernet | nROK 7271-WIC4: - 1-port LAN M12 X-coded, 10/100/1000/2500 Mbps Intel® I226 GbE (WOL support) - 4-port Independent LAN M12 X-coded, 10/100/1000/2500 Mbps Intel® I226-IT GbE, PoE 802.3af/at, max. 60W, non-isolated (without PoE extension card) / 30W (with PoE extension card) nROK 7271-WI: - 2-port LAN M12 X-coded, 10/100/1000/2500 Mbps Intel® I226 GbE (WOL support) |
| Security | TPM 2.0: InfineonSLB9665TT2.0FW5.62 |
| I/O Interface-Front | 4 x LED indicators (storage/WWAN/WLAN/programmable) 1 x HDMI 2.0a/b 2 x USB 3.2 Gen 2 type A (5V/0.9A) 2 x Externally accessible dual nano-SIM card slots with covers 1 x microSD card slot with covers 2 x 2.5” removable SSD tray 1 x Reset button 1 x Power button nROK 7271-WIC4: - 1 x M12 X-coded LAN port - 4 x M12 X-coded PoE 802.3af/at nROK 7271-WI: - 2 x M12 X-coded LAN ports 1 x Fan power connector 1 x SMA connector for GNSS 4 x SMA connector holes for WWAN 2 x Externally accessible dual nano-SIM card socket holes with covers, 8 x SMA connector holes for WWAN and 2 x for WLAN RP-SMA connector hole (reserved for 5G/Wi-Fi expansion card) |
| I/O Interface-Rear | 1 x VGA 1 x M12 A-coded 8-pin for 2 x USB 2.0 1 x M8 (AUDIO) 1 x Microphone input, 1 x Line output 2 x DB9 (COM1/2) for full RS232/422/485 (isolation) 1 x DB15 (CAN/DIO) - 2 x Isolated CAN FD, compatible with CAN2.0A/2.0B - 4 x DI and 4 x DO (isolation), power at source for DIO isolation, 14~48VDC 1 x M12 K-coded 5-pin for power input 1 x 2-pin connector for firing input 4 x SMA connector hole for WWAN 4 x RP-SMA connector hole for WLAN |
| Power Management and Software Support | Power input 24~110VDC isolated (occupied backside expansion) Optional 2.2~3s (170W~120W) protection against transient voltage drops (with supercapacitor board, occupied backside expansion) Software selectable startup and shutdown voltage for low power protection 8-stage power on/off delay time adjustment by software Support S3/S4 suspend mode 10~255 seconds WDT support, software setup SDK (Windows/Linux) including utility and sample code |
| Operating System | Windows 11/Windows 10/Linux |
| Dimensions | 260 x 210 x 110 (W x D x H) (mm) |
| Weight | nROK 7271-WIC4: 6.98 kg nROK 7271-WI: 6.93 kg |
| Environment | Operating temperatures - EN 50155, class OT3 (-35°C ~70°C), 85°C for 10 minutes (with 35W TDP CPU, 60W PoE, 8GB memory, industrial SSD) with airflow Storage temperatures: -40°C to 80°C Relative humidity: 90% (non-condensing) Vibration (random) - 2g@5~500 Hz (operating, SSD) Vibration (SSD) - Operating: MIL-STD-810H, Method 514.8C, Procedure 1, Category 4, common carrier U.S. highway truck vibration exposure - Storage: MIL-STD-810H, Method 514.8E, Procedure 1, Category 24, minimum integrity test Shock (SSD) - Operating: MIL-STD-810H, Method 516.8, Procedure I, functional shock=40g - Inoperative: MIL-STD-810H, Method 516.8, Procedure V, crash hazard shock test=75g |
| Certificates | CE/UKCA/FCC Class A EN 50155: 2021 - Ambient temperature EN 50155, Class OT3 (-35°C ~70°C), 85°C for 10 minutes - Voltage supply interruptions class S1, S2 (with supercapacitor card), S3 (with supercapacitor card) - Supply change class C1, C2 (with supercapacitor card) - EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019 - Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30 - Shock and vibration IEC 61373 Class B - Protective coating class PC1 (PC2 on request) EN 45545-2: 2020+A1: 2023 |
| Options | Intel® Core™ CPU: - i9-12900E/12900TE, Core: 16c, Max Frequency: 5.0/4.8GHz, TDP: 65W/35W - i7-12700E/12700TE, Core: 12c, Max Frequency: 4.8/4.6GHz, TDP: 65W/35W - i5-12500E/12500TE, Core: 6c, Max Frequency: 4.5/4.3GHz, TDP: 65W/35W - i3-12100E/12100TE, Core: 4c, Max Frequency: 4.2/4.0GHz, TDP: 60W/35W SO-DIMM DDR5-4800MHz: - 64GB (future), 32GB, 16GB, 8GB FAN Kit - Model No.: VTK FAN120-02, Description: 120mmx120mm, P/N: 10VK00FAN02X0 * Note: 65W CPU must be included with the fan kit |
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