Nexcom Train Console – vROK 3030
10.4” Rail Open Frame Panel PC with Intel Atom® x6414RE Processor
Main Feature
- Intel Atom® x6414RE quad-core processor, 9W
- 10.4-inch TFT LCD monitor with PCAP touch (BOM optional)
- IPS LCD with wide viewing angle and 1024 x 768 resolution
- Sunlight readability: 1,200 nits LCD brightness
- LCD monitor, 1 x HDMI, 1 x DP video output for triple displays
- Isolated CANBus 2.0 x 1
- CVBS input x 4 for analog camera (works with optional capture card)
- PoE supported for IP camera x 2 (optional)
- Open frame design for a wide range of form factors
- EN 50155, class OT3 (-30°C~70°C) certified for railway
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Datasheet
vROK 3030, a 10.4-inch all-in-one railway open frame panel computer, is designed for Human Machine Interface (HMI) and Passenger Information System for railway applications. It applies the latest Intel Atom® x6414RE processor on both Windows and Linux platforms . It can support analog camera x 4 (work with optional capture card) or PoE camera x 2 (optional) for security purpose. 1,200 nits LCD panel guarantees reaching sunlight readability. LCD monitor for triple displays with passenger information, advertising or in-car infotainment, 1 x HDMI, 1 x DP video output. Mini-PCIe slot x 1 and M. 2 slot x 2 design are supported, mSATA/capture card for data transmission and WLAN/WWAN wireless connection. The open frame design can integrate into a wide variety of configurations and form factors.
| LCD Panel | 10.4-inch TFT LCD panel with LED backlight 1024 x 768 pixels Brightness: 1200 cd/m² (typical) Viewing angle: 170° (H)/170° (V) Contrast ratio: 900:1 (typical) |
| Touch Screen (BOM optional) | Estimated capacitive Anti-glare coating surface Transmission rate: 85% ± 3 |
| Processor | Intel Atom® x6414RE quad-core processor, 1.5GHz, TDP 9W |
| Memory | 1 x 260-pin DDR4 SO-DIMM socket supports 3200MHz, up to 32GB. Default 2666MHz with 4GB In-Band ECC (IBECC) |
| Video Output | 1 x HDMI 1.4b up to 3840 x 2160@30 Hz 1 x DP 1.4 up to 4096 x 2160@60 Hz |
| Storage | 1 x M.2 2280 Key M socket (SATA 3.0 or PCIe 3.0 x1) 1 x mSATA (occupied mini-PCIe slot) |
| Expansion | 1 x M.2 2230 Key E socket (USB 2.0, PCIe 3.0 x2) 1 x Full-size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA 3.0) 1 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.2 Gen2) For LTE/5G NR module, BOM optional 1 x Full-size mini-PCIe socket (USB 2.0, USB 3.2 Gen2 (BOM optional)) for LTE module, 1 x external micro SIM slot, 1 x internal micro SIM slot |
| GNSS and Onboard Sensor | 1 x Default U-blox NEO-M9N GNSS module for GPS+QZSS /Glonass/Galileo/Beidou 1 x 3D accelerometer and 3D gyroscope |
| Power over LAN and Ethernet | 2-Port LAN M12 X-coded, 10/100/1000/2500 Mbps, Intel® I225-IT (optional PoE 802.3af/at, max. 30W, with VIOD-POE2-01) |
| Security | TPM 2.0: Infineon SLB9670VQ2.0 FW7.62 |
| I/O Interface-Lateral | Right Side - 1 x System reset button - 1 x USB 3.2 Gen2 type A connector - 1 x Micro-SIM slot with cover |
| I/O Interface-Rear | 2 x DB9 (COM1/COM2) (with isolation) for full RS232/RS422/RS485 1 x Power connector, M12 A-coded 5-pin 2 x 10/100/1000/2500 Mbps LAN, M12 X-coded 8-pin 2 x for USB 2.0 1 x M12 A-coded 8-pin 1 x Line in (stereo), 2 x Line out (stereo) (AUDIO, DB9, female) 1 x HDMI output 1 x DP output 1 x M12 (MULTI-PORT, A-coded 17-pin) - 4 x DI (isolated) - 2 x DO (isolated) - Power input for DIO isolation, 14~48VDC - 1 x Isolated CANBus 2.0B - 1 x Power switch - 4 x Composite video input 1 x for Bluetooth RP-SMA connection hole 3 x RP-SMA connector hole for WLAN 2 x SMA connector hole for WWAN 1 x SMA connector for GNSS 1 x Ground connector |
| Mechanical | Cooling system: fanless Housing: metal Mounting: open frame mounting, VESA 75 mounting Dimensions: 309 x 230.6 x 67.7 mm Cut-out size: 212.2 x 159.4 mm Weight: 3.0 kg |
| Power Management | 24/36V DC (14 ~ 48VDC) input, non-isolated 24/110V DC input, isolated (BOM optional) Reverse protection, OCP and UVP Software selectable startup and shutdown voltage for low power protection 8-stage power on/off delay time setting by software 10~255 seconds WDT support, software setup SDK (Windows/Linux) including utility and sample code |
| Environment | Operating temperatures - EN 50155, class OT3 (-30°C~70°C), 85°C for 10 minutes (with 9W TDP CPU, industrial SSD) with airflow - EN 50155, class OT1 (-30°C~60°C), with 9W TDP CPU, industrial SSD, PoE, with airflow Storage temperatures: -40°C to 80°C Relative humidity: 10% to 90% (non-condensing) Vibration (random) 2g@5~500 Hz (operating, SSD) Vibration - Operation: MIL-STD-810H, 514.8C Procedure 1, Category 4 - Storage: MIL-STD-810H, 514.8E Procedure 1, Category 24 Shock - Operation: MIL-STD-810H, Method 516.6, Procedure I, trucks and semi-trailers = 40g - Collision hazard: MIL-STD-810H, Method 516.6, Procedure V, ground equipment = 75g |
| Operating System | Windows 10/Windows 11 Linux |
| Standards/Certificates | BU FCC Class A EN 50155: 2017 - Ambient temperature EN 50155, Class OT3 (-30°C~70°C) - Voltage supply interruptions class S1 - Supply variation class C1 - EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019 - Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30 - Shock and vibration IEC 61373 Class B - Conformal coating class PC1 (PC2, on request) EN 45545-2: 2020 (PCBs) |
| Driver | ||||
|---|---|---|---|---|
| History | Definition | Version | YOU | Download |
| 2022-07-19 | Sound | Windows | 217.03MB | |
| 2022-07-19 | Chipset | Windows | 3.98MB | |
| 2022-07-19 | CSE | Windows | 171.1 MB | |
| 2022-07-19 | Ethernet | Windows | 755.19 MB | |
| 2022-07-19 | Graphics | Windows | 628.2 MB | |
| 2022-07-19 | PSEIO | Windows | 1.13 MB | |
| 2022-07-19 | SDK | Windows | 0.86 MB | |
| 2022-07-19 | Series I | Windows | 0.98MB | |
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